2010/12/01 - 14:49 |
NEEDS Projekt zum 1.12.2010 gestartet |
2011/03/01 - 14:51 |
Projektflyer steht zum Download bereit |
2011/03/04 - 18:02 |
Erfolgreiches NEEDS KickOff hat am 4.3.2011 in München stattgefunden |
2011/04/11 - 09:52 |
Test Issues for 3D Chips (DAC Blog, 7.4.2011) |
2011/04/20 - 10:04 |
Design for 3D Silicon Integration Workshop Ende Juni in Grenoble |
2011/05/24 - 14:39 |
Imec and Atrenta develop exploration flows for 3D ICs |
2012/02/02 - 12:43 |
Wanted: 3-D IC standards within six months |
2012/02/02 - 13:01 |
CEA-Leti launches Open 3D initiative to include design, layout, testing and packaging |
2012/04/13 - 10:59 |
Synopsys 3D-IC-lnitiative |
2012/04/17 - 16:16 |
EDPS: 3D ICs |